In the daily hubbub of current “crises” facing humanity, we forget about the many generations we hope are yet to come. Not those who will live 200 years from now, but 1,000 or 10,000 years from now. I use the word “hope” because we face risks, called existential risks, that threaten to wipe out humanity. These risks are not just for big disasters, but for the disasters that could end history.

President Obama vowed to tackle climate change in his second inaugural address today.

IBM and 3M are collaborating on a new kind of semiconductor glue that will bind together future generations of 3-D semiconductor chips. The idea is to create a whole new kind of adhesive that hold things tightly together while also conducting heat and insulating at the same time.